Vishay Semiconductors BiSy Chip Level Package ESD Protection Diodes

Picture for category Vishay Semiconductors BiSy Chip Level Package ESD Protection Diodes

02 May 2018

Vishay BiSy Chip Level Package (CLP) ESD Protection Diodes feature one-line or two-line ESD-protection with a working range of ±3.3V, ±5.5V or ±26.5V and a low leakage current of <0.05µA or <0.1µA. These Bidirectional Symmetrical (BiSy) diodes have low load capacitance. The diodes are housed in ultracompact CLP packages with a low <0.3mm packing height. CLPs are easier to solder versus the ball and grid array packages, which makes Vishay ESD protection diodes smaller, lighter, stronger, and better.

FEATURES

Single-Line Features

-Ultracompact CLP packages

-Low package height < 0.3mm

-1-line ESD-protection

-Working range ±3.3V, ±5.5V

-Low leakage current < 0.1μA

-Low load capacitance VCUT03E1-SD0: CD

-Lead plating: Au (e4)

-ESD-protection acc. IEC 61000-4-2:

-±16kV or ±30kV contact discharge,

-±16kV or ±30kV air discharge

-Lead material: Ni

-Topside coating

-e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn)

Dual-Line Features

-For CAN and FLEX-Bus applications

-Small SOT-23 package

-AEC-Q101 qualified available

-2-line ESD-protection

-Working range ± 26.5V

-Low leakage current IR < 0.05μA

-Low load capacitance CD < 13pF

-ESD-protection acc. IEC 61000-4-2

-± 30kV contact discharge

-± 30 kV air discharge

-e3 - pins plated with tin (Sn)

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